Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is proud to announce that it has been honored with a 2025 Mexico Technology Award in the Cleaning Equipment category for the Sawa SC-SA1 Pneumatic Air-Driven Fully Automatic Stencil Cleaner.

The award highlights the SC-SA1’s outstanding innovation, safety, and energy-efficient design. Engineered by Sawa for high-performance production environments, the SC-SA1 is a next-generation solution for cleaning SMT stencils, squeegees, and large PCB assemblies.

Unlike conventional systems, the SC-SA1 operates using only compressed air—eliminating the need for electricity. This not only minimizes energy consumption but also reduces fire hazards in sensitive manufacturing environments. The system features a fully enclosed design to prevent leaks and incorporates a three-stage filtration system that significantly extends the life of the cleaning agent, reducing waste and operational costs.

Built from durable stainless steel and offering simple one-button operation, the SC-SA1 combines ease of use with exceptional reliability and safety. Its compact footprint and low-maintenance design make it an ideal fit for modern production lines striving for both sustainability and efficiency.

“Winning this award is a proud moment for our team,” said Michelle Ogihara, Executive VP, Seika Machinery. “The SC-SA1 is a smart, energy-efficient solution that solves real challenges on the production floor. We’re excited to see it making a strong impact in the industry.”

The Mexico Technology Awards recognize the most recent technological innovations in Mexico’s manufacturing landscape, spotlighting achievements by OEM manufacturing equipment and materials suppliers over the past year. For more information about the awards, please visit: www.mexicoems.com/mta-awards.

For more information about the Sawa SC-SA1 or Seika Machinery’s full product line, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.