YINCAE, a global leader in advanced electronic materials, is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at IMAPS, San Diego, September 30 – October 1. Visitors will experience next-generation solutions designed to meet the reliability, thermal, and processing challenges of today’s most demanding electronic applications.
Highlights at the IMAPS:
- High-Performance Underfill (UF 120HA2):
- 100% compatible with no-clean flux residue
- Passes 10×260°C reflow without cleaning
- Low CTE for superior reliability
- Fast flow and rapid cure for efficient assembly
- Advanced Die Attach Materials (TM 230-2):
- Low-void, high-reliability solutions
- Low-temperature process compatibility
- Options for both soldering and sintering for large-die applications
- Next-Generation Liquid Metal Solutions ( TM 150LM):
- High viscosity and superior reliability
- No blow-out or pump-out, even under thermal cycling
- Exceptional heat dissipation for TIM1, TIM1.5, and TIM2 applications
“Our portfolio demonstrates a unique combination of thermal performance, reliability, and process efficiency,” said Dr. Wusheng Yin, CEO at YINCAE. “We’re excited to showcase materials that enable the future of advanced packaging and high-power devices.”
Join us at Booth #817 at the IMAPS Symposium 2025 in San Diego, CA (Sept. 30 – Oct. 1) for a live demo and to meet our team. To learn more, email us at info@yincae.com or visit www.yincae.com.
