KIC, the leader in smart thermal process technologies for electronics manufacturing, is pleased to announce that Miles Moreau, General Manager of KIC, will present the company’s latest study, “Thermocouple Tactics: A Comparative Study of Attachment Methods”, at the upcoming SMTA Long Island Expo. The Expo is Wednesday, September 10 at the Marriott in Melville, New York.
Developed in collaboration with the Rochester Institute of Technology (RIT), Shea Engineering, and DYMAX, this landmark study evaluates common thermocouple attachment methods—including high-temperature solder, aluminum tape, polyimide tape, and thermally conductive adhesives—on high-density circuit boards. The research provides new insights into how attachment techniques influence measurement accuracy, repeatability, and reliability in the thermal profiling process.
“Choosing the right thermocouple attachment method is critical to achieving consistent and accurate thermal profiles in reflow soldering,” said Miles Moreau. “This study provides clear data that can help manufacturers optimize their process control in increasingly compact and complex PCB designs.”
Attendees will gain a deeper understanding of:
- The impact of adhesive formulation on measurement reliability.
- Why common tape methods may fail on densely populated PCBs.
- How solder volume influences heat transfer accuracy.
- Real-world application results based on HDI boards and populated test vehicles.
We invite you to join Miles. This is for anyone seeking to enhance their knowledge in process control and thermal profiling.
For more information about KIC’s profiling technologies, visit www.kicthermal.com.
