Essemtec, a global leader in adaptive, highly flexible surface mount technology (SMT) solutions, is pleased to announce its participation at TechBlick’s Electronics Reshaped USA event, taking place June 11–12, 2025 in Boston, Massachusetts. The company will share its latest innovations during a technical session focused on jetting and mounting technologies for printed electronics.
Essemtec will be represented by Eric Wolf and Scott O’Donnell (of Restronics) at the event. Eric Wolf will deliver a presentation titled “Jetting and Mounting Solutions for Printed Electronics: Overcoming Process Challenges,” showcasing Essemtec’s advanced capabilities in dispensing and placement for emerging electronics applications.
With the rise of wearable sensors, flexible displays, and smart medical devices, printed electronics are redefining how thin, lightweight, and flexible electronics are designed and manufactured. However, this evolution brings new material and process challenges—particularly in the transfer and assembly of unconventional materials and ultra-small components.
Eric Wolf’s presentation will address these challenges head-on, exploring how Essemtec’s adaptive all-in-one platforms support:
- High-precision jetting of conductive and non-conductive adhesives
- Accurate component placement on non-traditional substrates
- Solutions for fine-pitch, high-density designs used in next-generation electronics
Real-world test cases and examples will be shared to illustrate how Essemtec’s technologies have helped customers streamline production and improve yield in demanding printed electronics applications.
TechBlick Boston brings together leaders in printed, hybrid, and flexible electronics for two days of learning, collaboration, and innovation. Essemtec’s session is part of the event’s focus on practical advances in additive manufacturing, stretchable electronics, and packaging for advanced applications.
For more information about Essemtec and its full line of adaptive SMT solutions, visit www.essemtec.com.
