KOKI, a global leader in advanced soldering materials and process optimization services, will host a free, live webinar on Thursday, May 29, 2025, at 12:00 PM CDT titled “A Residue-Free Soldering Solution for Power Devices with Formic Acid Reflow.” The session will be led by Shantanu Joshi, KOKI’s Head of Customer Solutions and Operational Excellence.
This technical presentation explores a game-changing Zero-Flux Residue solder paste engineered for formic acid reflow applications—an ideal solution for power device soldering where cleanliness and reliability are top priorities. Unlike conventional flux-based options, this innovative formulation leverages formic acid’s reduction power and introduces thermally robust agents that protect the solder powder during reflow. The result is a true no-clean process, with all flux components entirely evaporating before peak temperatures are reached.
Participants will learn how this clean soldering approach can eliminate secondary cleaning steps, reduce process costs, enhance solder joint performance, and support environmentally conscious manufacturing practices. This session is tailored for electronics manufacturers, process engineers, and production decision-makers seeking advanced solutions for complex soldering challenges.
Reserve your spot now: www.meet.zoho.com/bkZ6-X84-L9u.
