KIC, the leader in smart thermal process technologies for electronics manufacturing, is pleased to announce that General Manager Miles Moreau will present the company’s latest study, “Thermocouple Tactics: A Comparative Study of Attachment Methods,” at the upcoming LA/OC SMTA Chapter meeting. The event will be held Wednesday, May 29, 2025, from 6-8 pm. at Siemens Industry Software in Costa Mesa, CA.
Developed in collaboration with the Rochester Institute of Technology (RIT), Shea Engineering, and DYMAX, this landmark study evaluates common thermocouple attachment methods, including high-temperature solder, aluminum tape, polyimide tape, and thermally conductive adhesives, on high-density circuit boards. The research provides new insights into how attachment techniques influence measurement accuracy, repeatability, and reliability in the thermal profiling process.
“Choosing the right thermocouple attachment method is critical to achieving consistent and accurate thermal profiles in reflow soldering,” said Miles Moreau. “This study provides clear data that can help manufacturers optimize their process control in increasingly compact and complex PCB designs.”
Attendees will gain a deeper understanding of:
- The impact of adhesive formulation on measurement reliability.
- Why common tape methods may fail on densely populated PCBs.
- How solder volume influences heat transfer accuracy.
- Real-world application results based on HDI boards and populated test vehicles.
This event is open to SMTA members and industry professionals seeking to enhance their knowledge in process control and thermal profiling.
For more information or to RSVP, please visit the LA/OC SMTA chapter website.
For more information about KIC’s profiling technologies, visit www.kicthermal.com.
About: KIC is a leading provider of thermal profiling and process control solutions. With a commitment to innovation and quality, KIC delivers cutting-edge technologies that help manufacturers enhance production efficiency, product quality, and sustainability.
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