Heraeus Electronics will highlight its latest advancements in high-reliability materials for power electronics through a series of live presentations at PCIM Europe 2025, scheduled to take place May 6-8, 2025 in Nuremberg, Germany. Visitors can explore Heraeus Electronics’ wide range of material solutions at Hall 6, Booth 6-310.
Among the highlights at PCIM will be the debut of DTS® Silver, a next-generation Die Top System material designed for high-performance applications at an optimized cost. The Heraeus Die Top System (DTS®) enables copper wire on sintered power semiconductors, delivering exceptional flexibility. DTS® enhances electrical and thermal conductivity, strengthens die connection reliability, and optimizes overall module performance. The innovative solution DTS® Silver is free of palladium and gold, offering a cost-efficient yet highly reliable alternative for power electronics manufacturers.
Heraeus Electronics will also showcase Condura®.ultra, a silver-free AMB bonding technology for metal-ceramic substrates. Designed for high-end applications and with a low total cost of ownership Condura®.ultra maintains outstanding reliability. Condura®.ultra enables the use of thicker copper layers while allowing thinner ceramics, maintaining equal thermal resistance compared to traditional AlN substrates. With high thermal conductivity (>80 W/m∙K), this innovative material is ideal for sintering, bonding, and soldering processes, offering exceptional performance.
Experts from Heraeus will deliver two insightful presentations at the e-Mobility & Energy Storage Stage (Hall 6, Booth 220), providing in-depth insights into cutting-edge materials for power electronics:
• “Heraeus Electronics Introduces the Next Generation DTS®”
o Speaker: Christian Kersting
o Date & Time: May 6, 12:30 PM
• “Ag-Free Silicon Nitride AMB Substrates for Automotive Power Module Applications”
o Speaker: Oliver Mathieu
o Date & Time: May 7, 12:55 PM
Heraeus Electronics will also host several live product presentations at its booth, showcasing the latest advancements in power electronics materials:
• DTS® Silver – The innovative solution for cost-optimized, high-performance applications
• Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 PM
• Condura®.ultra – A cost-effective, silver-free Silicon Nitride AMB for demanding applications
• Live Presentation: May 6th, 11:00 PM and May 8th, 13:00 PM
• mAgic PE360 – Pressure silver sinter paste for module attach applications
• Live Presentation: May 6th, 14:00 PM
• Fastlane – An EU-funded project accelerating the European value chain for power electronics
• Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 PM
Heraeus Electronics invites attendees to visit Hall 6, Booth 6-310 to experience these solutions and more first-hand and engage with technical experts.
To learn more, visit www.heraeus-group.com.
