Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim,California.

Live@APEX is a unique collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, partners, and, most importantly, the customers, who get to experience the equipment and materials in a live-action environment.

“At Indium Corporation, our motto ‘From One Engineer to Another®’ is foundational to the way we work,” said Product Development Specialist Miloš Lazić.“Live demonstrations of these products give attendees a clear and honest look at their real-world performance. We take great pride in our products and we look forward to showcasing them at IPC APEX.”

This year’s program will highlight Indium Corporation materials, including:

  • CW-818 – no-clean, high-reliability flux-cored wire
  • FP-500 – no-clean flux pen
  • 9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
  • 88HF – no-clean solder paste for use in package-on-package (PoP) applications
  • 8HF – jetting and microdispensing solder paste
  • NC-506 – a low-viscosity thixotropic no-clean flux designed for use in ball-attachment to substrates
  • Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
  • TACFlux® 089HF – no-clean flux formulated for SnAgCu and SnAg solders (also compatible with Sn/Pb solder)

Attendees can see these products at the following partner booths:

If you see an Indium Corporation product running in a booth, be sure to use the hashtag #LiveatAPEX.

To learn more about the Live@APEX program, contact Lazić at mlazic@indium.com.

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