As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout SMTA International (SMTAI), October 21-24, in Rosemont, Illinois.

Monday, October 21

  • Supercooled Solder Pastes in Low-Temperature Attach Applications by Dr. Yifan Wu, co-authored by Dr. Ian Tevis and Radhika Jadhav
    • This presentation discusses the use of metastable solder pastes as a solution for low-temperature soldering, enabling full metal interconnects at significantly lower temperatures. The study highlights the application of supercooled bismuth-tin (BiSn) pastes in next-generation electronics, where traditional high-temperature processing could cause material degradation.

Wednesday, October 23

  • Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components by Sr. Product Specialist – Semiconductor and Advanced Assembly Materials, Evan Griffith, co-authored by Ravi Parthasarathy, ZESTRON Corporation, and Patrick Lawrence, ITW EAE
    • This presentation will address the growing challenges in cleaning advanced packaging technologies, such as SiP, fcBGA, PoP, and 2.5D, as these designs incorporate larger die sizes, more bump counts, and lower standoff heights. The results will provide insights into optimization advantages, helping manufacturers reduce the risk of failures, improve efficiency, and ensure optimal cleaning consistency and repeatability.

Thursday, October 24

  • Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach by Evan Griffith, co-authored by David Heller, Xike Zhao, Phil Lehrer, Heller Industries
    • This presentation will explore the challenges of miniaturization in electronics, particularly the difficulty of choosing an appropriate material for soldering in flux-free environments. This paper will introduce a novel tacky agent for use in formic acid reflow, and offer a material and equipment solution for customers looking to jointly use paste and flux in a formic acid reflow system for advanced packaging builds.
  • Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits by Ronald Lasky, co-authored by Senior Sales and Business Development Manager Chris Nash and Regional Product Manager Wisdom Qu
    • This presentation will focus on the challenges brought on by the warpage of large-size IC packages, particularly in ball grid array (BGA) formats, used in server CPUs/GPUs. The session will propose solutions to mitigate these issues in electronic assembly.

In addition, two Indium Corporation experts will serve as chairs for two extended sessions:

  • On Tuesday, October 22, 8:30am – 10:00am, Dr. Lasky will chair the Solder Joint Reliability
  • On Wednesday, October 23, 11:30am – 12:30pm, Dr. Mutuku will chair the Thermal Fatigue Reliability session

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at SMTAI in booth #2300.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.

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