Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA. Payne’s presentation, scheduled for May 9, will examine the challenges and benefits of transitioning from high-Pb solder to Pb-free solder for die-attach in discrete power applications.
High-Pb solder has long been the standard material for die-attach in discrete power devices; however, market-leading device manufacturers have been actively working with suppliers to find alternatives. In addition to Pb-free solders, other options are being considered, including TLPS, adhesives, and sinter materials. Focusing on a novel, dual-alloy, high-temperature, Pb-free solder, Payne will explore the pros and cons of the different material options and explain why Pb-free solder shows the most promise as an alternative to high-Pb solutions.
“The results and analysis presented will highlight how this new Pb-free solder can outperform Pb-based solder in some aspects of function and reliability,” said Payne. “With successful customer trials already completed, this new Pb-free solder is ready for industry adoption.”
Payne is responsible for driving the profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
