Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented at the IPC APEX Expo in Anaheim, California, on April 10.
The NPI Awards recognize the leading new products for electronics assembly during the past 12 months. An independent panel of practicing engineers selects honorees.
“At Indium Corporation, we believe that materials science changes the world,” said Vice President of Sales, Marketing, and Technical Service, Tim Twining. “It is a tremendous honor for Indium8.9HFRV, a new innovative product, which reduces voiding and improves the reliability of our customers’ products, to be recognized with CIRCUITS Assembly’s prestigious NPI Award.”
A flux vehicle developed from the industry-leading Indium8.9HF chemistry, Indium8.9HFRV is a new air reflow, no-clean solder formulated to improve the voiding performance of next-generation Pb-free high-reliability alloys. Applications requiring extended thermal cycling performance at higher temperatures may require suitable high-reliability alloys. Indium8.9HFRV is a superior choice for high-reliability alloys, providing both voiding mitigation performance and excellent electrical and process reliability. The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry for other applications.
Among its key features, Indium8.9HFRV offers:
- Low voiding
- High transfer efficiency through small apertures (≤0.66AR)
- Excellent wetting
- Outstanding response-to-pause performance
- Compatibility with both Air and N2 reflow environments
For more information about Indium Corporation’s no-clean, Pb-free solder pastes, visit www.indium.com/products/solders/solder-paste/lead-free/no-clean/.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
