Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.

Jensen’s presentation, titled Innovative Metal TIM Technology for TIM1 in BGA Style Semiconductor Packages, will focus on the use of metal TIMs in a broader array of applications for which traditional polymer TIM materials are no longer suitable. Solder TIM (STIM) materials have been used as a TIM1 solution for a limited set of server packages for over 20 years due to their potential to provide extremely high amounts of heat dissipation.  Because of increasing power and functionality of HPC packages, many of the traditional polymer TIM materials are reaching their physical limits for heat dissipation.

Lazić’s presentation, Integration of Thermally Conductive Tacky Agents with Compressible TIMs to Improve Thermal Performance, will examine a compressible metal foil designed to be used as a TIM between a heat source and a heat-sink, heat-spreader, or heat-pipe. Metals and alloys have been used in different forms as TIMs for many years. Generally, they have several advantages compared to other commercially available TIMs. Since they have higher thermal conductivity than polymeric TIMs, these materials are less sensitive to bond line thickness and coplanarity issues.

At Indium Corporation, Jensen leads a matrixed team focused on engaging customers and commercializing new technology for our Thermal Interface Material products, including technology for 5G and AI. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers. He has authored numerous technical papers on soldering and thermal technology. He has a bachelor’s degree in chemical engineering from Clarkson University and an MBA from Syracuse University.

Lazić is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. He earned his master’s degree in electronics engineering and his bachelor’s degree in electrical engineering from the University of Nis in Serbia. He is an Energy Efficiency Engineer certified by the Serbian Chamber of Engineers in Belgrade; a Certified SMT Process Engineer; and is fluent in English, Serbian, Croatian, and Bosnian.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.