Indium Corporation® is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in and test at TestConX 2024, March 3-6 in Mesa, Ariz., U.S.
As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase selections from its array of high-performance metal TIM solutions.
Renowned for their superior thermal conductivity compared to non-metals, Indium Corporation’s indium-containing TIMs for burn-in and test stand out, with pure indium metal delivering 86W/mK. These TIMs are available in various forms, including pure indium, indium-silver alloys, and indium-tin. The pure indium TIM can be optionally clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent indium from adhering to the surface. Indium Corporation’s suite of standard Heat-Spring® solutions, which feature a compressible interface between a heat source and a heat-sink, include:
Heat-Spring® HSD
- The original and best standard option for interfaces with flat, smooth and parallel surfaces.
- Designed for interfaces with tight surface control >30psi
Heat-Spring® High Profile Preforms
- Patterned to optimize contact with non-planar surfaces delivering 86W/mK
- Ideal for assemblies with an extruded, unfished heatsink
- Recommended for immersion cooling and Burn-In applications
- Provides uniform contact between the burn-in head and the DUT
- Provides more uniform thermal conductivity
- Recyclable and reclaimable
Heat-Spring® HSK
- Recommended specifically for burn-in applications where multiple insertions are required
- Provides uniform contact with low resistance for high-density heat loads
- Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
- No staining or cracking
To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX or online at indium.com/TIM.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
