Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers’ exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.

Precision form and trim of SMT flat-pack and axial and radial lead through-hole components are supported in both low and high-volume quantities. A calibrated optical comparator is used to verify that the lead forming meets all specified dimensions.

A robotic hot solder dip (RHSD) component lead tinning process usually follows trim and form to coat the component leads with solder to prevent oxidation or to remove gold plating from the formed leads.  Device packaging options include JEDEC trays, tape-and-reel, waffle packs, or custom trays. Components can be MSL-baked and dry-packed per industry protocols.

“For 40 years, leading electronics manufacturing companies have relied on Circuit Technology Center as the world leader and innovator for circuit board damage repair, rework, BGA re-balling, and component modification services,” said Andy Price, Sales Manager. “We are thrilled to add this new component trim and form capability to our line-up of service offerings.”

For more information about the component trim and form service offered by Circuit Technology Center, visit: