SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.

The key features of the SMBF-08 flux include its visible black coloration, which allows for easy identification and evaluation during the automated optical inspection (AOI) process. Unlike traditional transparent BGA fluxes, the visible black residue of SMBF-08 can be readily detected, providing customers with an efficient way to assess flux application.

In addition to its enhanced visibility, SMBF-08 is halogen-free (ROL0) and fully compliant with RoHS, RoHS 2.0, and REACH regulations. This ensures its environmental compatibility and adherence to industry standards.

SMBF-08 is a versatile flux suitable for various processes, including stencil printing, dipping, and pin-transfer methods. Its excellent printability, wettability, and solderability make it highly effective for a wide range of IC packages, including system-in-package (SIP), wafer-level-package (WLP), and flip chip technologies.

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SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.