Kurtz Ersa Inc., a leading supplier of electronics production equipment, today announced the dates for its upcoming VERSAFLOW 3 Maintenance and Application Training Courses at its Plymouth headquarters. The VERSAFLOW 3 Selective Soldering Level II Maintenance Training Course will be held from Tuesday, March 14, 2023 at 8:30 a.m. to Wednesday, March 15, 2023 at 5 p.m. The VERSAFLOW 3 Selective Soldering Level II Application Training Course will take place Thursday, March 16, 2023 from 8:30 a.m. to Friday, March 17, 2023 at 5 p.m.
Both classes will bring attendees to the knowledge level needed to keep your selective soldering machine running at its peak performance and reduce unnecessary downtime. For the application class, participants are encouraged to bring or ship any challenging products to the facility so that Ersa’s application specialist can help to fine tune your program and get the best process time achievable.
The Maintenance Training Course will provide students with the ability to properly maintain the VERSAFLOW 3 and prevent downtime. In addition to an advanced machine overview, the course will provide training for preventative maintenance, troubleshooting, calibration and more.
The Application Course will provide the knowledge and hands-on experience for process application and programming on the VERSAFLOW 3 selective soldering machine. The goal of the course is to give the student the knowledge to properly maintain their process with minimal to zero defects with the highest throughput possible.
The VERSAFLOW 3 series is the world’s most utilized in-line selective soldering machine. The system achieves the highest flexibility and throughput with the smallest possible required space. In order to satisfy all demands in regards to flexibility, the third generation of Ersa´s VERSAFLOW selective soldering systems is based on a modular platform.
For more information or to register for the courses, e-mail Chad Suckow at chad.suckow@kurtzersa.com.
For more information about Kurtz Ersa Inc., visit www.ersa.com.