Viscom Inc., the US American subsidiary of Viscom AG, Germany, will showcase a selection of its highly advanced inspection systems for 3D SPI, 3D AOI, 3D AXI, and 3D MXI at IPC APEX EXPO 2023 – taking place January 24–26, 2023 in San Diego, California. Visitors are especially invited to discover exciting innovations from the system-related software area; highlights at the Viscom booth (No. 2501) include live demonstrations of the new digital platform vConnect.
Viscom’s large system portfolio is designed for many different requirements of today’s electronics manufacturing, including intelligent networking of the inspection gates. Standards for automated cross-manufacturer communication, such as IPC HERMES 9852 or IPC CFX, are used in conjunction with proprietary software applications like system operation with vVision or higher-level vConnect control tools. “Our team of experts is ready to demonstrate live access to extensive information on well-arranged dashboards, fast SPI, AOI, and AXI programming with improved eCAD imports, and also the effective use of artificial intelligence, which enables even more reliable decisions when verifying inspection results,” states Ed Moll, President of Viscom Inc.
Going far beyond standard PCB sizes and addressing the specific requirements of industries such as telecommunications, electromobility or renewable energies, Viscom covers a wide range of customer needs in the field of inline X-ray inspection. Visitors of the IPC APEX EXPO can get an up-close and personal look at the 3D AXI system iX7059 PCB Inspection XL which can handle PCBs up to 63” (1600 mm) in length. The innovative dynamic acquisition mode of the machine ensures particularly fast back calculation to generate extremely accurate CT slice images and display full 3D volumes at the verification station. Additionally, artificial intelligence is now able to reliably segment voids, which can then be measured in detail.
Another X-ray highlight at the show will be Viscom’s X8011-III manual inspection system with intelligent capabilities for networking with the production line, measuring radiation dose to components, and automatically generating meaningful reports. The versatility of the X8011-III makes many applications possible, from comprehensive quality control for production start-ups to one-hundred-percent inspections in high-mix-low-volume manufacturing, including total support from process optimization to the handling of specific tasks.
The S3088 ultra chrome system will be presented as a 3D SPI and as a 3D AOI variant. Thus, a camera module for solder paste inspection with a comparatively large image field and height measurement range, excellent z-resolution and maximum flexibility in lighting technology will be on display. Extremely powerful high-speed image acquisition will be one of the main topics in the context of optical solder joint inspection.
Among the key software-related topics at Viscom’s booth will be intelligent condition monitoring, centralized IT management and high-performance Big Data processing, all of which are modular components of vConnect. The platform’s broad portfolio of scalable, higher-level applications is designed to provide the optimal environment and infrastructure for enhanced digital connectivity. Extensive data is available via freely configured menus and selected according to the requirements of operators, service personnel or management. Based on smart analyses, e.g., potential machine glitch can be detected at an early stage and maintenance intervals optimized.
For more information, please visit www.viscom.com.
