Nihon Superior Co. Ltd., a supplier of advanced joining materials, is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2 is the high-strength alloy of choice when cracking minimization is a key selection criterion.
The demand of the automotive industry for solder alloys that deliver long life in conditions of extreme thermal cycling has resulted in the development of alloys that are very hard. While these hard alloys are resistant to the plastic deformation that drives failure in thermal cycling, the trade-off is that their hardness means that they have a tendency to crack when exposed to the other stresses to which automotive electronics is subjected in service. Nihon Superior’s LF-C2 strikes a balance between these two requirements, delivering long life in thermal cycling but with a compliance that means that it is resistant to cracking under other loading conditions.
This balanced performance is achieved by using calibrated levels of the two key strengthening tools available in solder alloy formulation, stable dispersed particles combined with solid solution strengthening of the tin matrix.
With a liquidus temperature of 213°C LF-C2 can be reflowed at a lower temperature than SAC305 and has a higher shear strength than SAC305.
The completely halogen-free P608 flux medium delivers wetting comparable with that achieved with halogen-containing flux media. LF-C2 delivers excellent performance over a wide range of component types and process parameters.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable connections, and lead-free die attach. For more information about Nihon Superior’s new alloys, solder pastes and lead-free products, please visit us at www.nihonsuperior.co.jp/english.
About Nihon Superior Co., Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company established its reputation by gathering the most advanced soldering and brazing technologies and products from around the world and supplying them to companies in the metal-joining industry, first in Japan and then to the global market. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market for electronics assembly materials. To support the growing demand for its products, Nihon Superior has established a network of manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
www.nihonsuperior.co.jp/english
