The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use various lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium.
In this new technical paper, Circuit Technology Center discusses a number of critical considerations when using robotic hot solder dip to process components to mitigate tin whiskers prior to circuit board assembly.
See the full paper at: https://www.circuitrework.com/features/1037.html
Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world.
For more information, please visit: circuitrework.com.
