Indium Corporation assistant product manager presenting on compressible metal thermal interface materials at TestConX China 2026

Indium Corporation Expert to Explore Factors Driving Performance of Compressible Metal TIMs at TestConX...

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Indium Corporation® Assistant Product Manager Foo Siang Hooi will discuss the critical factors that influence the performance of compressible metal thermal interface materials (TIMs)...
Bold Laser Automation LPC1010CO2 laser precision cutting and drilling platform for PCB and electronic materials

New CO2 Laser Cutting and Drilling Platform Enhances PCB and Electronic Materials Manufacturing

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Bold Laser Automation has introduced the LPC1010CO2 Laser Precision Cutting and Drilling Platform, a high-performance manufacturing system designed for precision drilling, skiving, cutting, trimming,...
GÖPEL electronic Video Dragon frame grabber and Microchip Technology ASA-ML SerDes chips for automotive video testing

GÖPEL electronic and Microchip Technology Collaborate to Expand the ASA-ML Ecosystem into Automotive Video...

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GÖPEL electronic and Microchip Technology, a broadline supplier of semiconductors, are deepening their collaboration in the field of ASA Motion Link (ASA-ML). GÖPEL electronic...
Microchip Technology PIC64-HPSC High-Performance Spaceflight Computing Series processor for space missions

Microchip Achieves Key Program Milestones for its PIC64-HPSC Spaceflight Computing Series

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Early radiation results and customer evaluations show progress toward high-performance computing for next-generation space missions. As civil, commercial, scientific and defense spacecraft become more...
Epec Engineered Technologies acquires Standard Printed Circuits, expanding U.S. PCB manufacturing capabilities

Epec Acquires Standard Printed Circuits, Expanding U.S. PCB Manufacturing Capabilities

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Standard Printed Circuits and Epec Engineered Technologies announce that Epec has completed the acquisition of Standard Printed Circuits, further expanding Epec's domestic manufacturing footprint...
Essemtec ribbon-cutting ceremony at new U.S. headquarters and demo center in Woburn, Massachusetts

Essemtec Opens New U.S. Headquarters and Advanced Demo Center in Greater Boston

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Essemtec, a global leader in adaptive and highly flexible SMT pick-and-place and dispensing equipment, with industry-leading All-in-One solutions combining jetting, placement, and inspection within...
Nordson SonoFlex Acoustic Microscopy Inspection system displayed at SEMICON West 2026 in San Francisco

Nordson Test & Inspection Wins 2026 Best of West Award

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Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions received the Best of West Award for the SonoFlex™ Acoustic Microscopy...
SEHO SelectLine-S selective soldering machine designed for the Asian electronics manufacturing market

SEHO Introduces SelectLine-S: German Engineering for the Asian Electronics Market

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SEHO Systems GmbH will introduce the SelectLine-S, a new selective soldering machine, at NEPCON Shenzhen 2026, taking place October 27–29 in Shenzhen, China. Developed...
Focus on Components B2B event logo featuring a microchip and brain design created by Politecnico di Milano students

NürnbergMesse Italia Launches “Focus on Components” B2B Event for Electronic Components in Vicenza

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Focus on Components will debut alongside Focus on PCB, the printed circuit board show covering PCB, PCBA and EMS, on 21 and 22 April...
Quasys Europe new sales structure for semiconductor manufacturing equipment and technical solutions

Quasys Europe Consolidates Sales in Semiconductor Manufacturing

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Quasys is realigning its activities in the European semiconductor market and establishing a sales structure for Europe through Quasys Europe. This structure will serve...
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