Kurtz Ersa electronics production equipment including soldering and rework systems on display at SMTA International 2026

Kurtz Ersa to Showcase Soldering, Rework and Production Solutions at SMTA International 2026

Kurtz Ersa, Inc., a leading supplier of electronics production equipment, will showcase a range of soldering, rework and electronics production solutions at SMTA International...
Koh Young Technology inspection systems and AI-powered solutions on display at NEPCON Asia 2026 in Shenzhen

Koh Young to Unveil Next-Generation Inspection and Smart AI Solutions at NEPCON Asia 2026

Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will unveil its latest inspection platforms and AI-powered process solutions at NEPCON...
Luxinar laser source used for PCB depaneling, cutting individual boards from a panel with precision

How Luxinar Lasers Optimize PCB Depaneling for Quality, Throughput and Process Stability

PCB manufacturers and equipment builders need to separate individual boards from a panel cleanly, repeatedly and at production speed without damaging the board, components...
KYZEN MICRONOX MX2123 cleaning chemistry winning the 2026 Mexico Technology Award at SMTA Guadalajara

KYZEN Wins Cleaning Materials Award from Mexico Technology Awards

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its MICRONOX® MX2123 cleaning chemistry has won a 2026...
Fuji NXTR SMT pick and place machine performing placement of Broadcom Tomahawk 6 Davisson CPO Ethernet switch component

Fuji Achieves Industry-First Placement of Broadcom’s Tomahawk® 6 – Davisson

Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereafter referred to as "Fuji") conducted an SMT placement evaluation of Broadcom's...
Tresky digital beamsplitter system showing up-looking and down-looking camera alignment for DIE bonding process

Tresky Eliminates the Need for an Optical Beamsplitter During DIE Bonding

Tresky GmbH takes a consistently digital approach to the visual alignment of high-precision DIE bonding processes. The digital beamsplitter eliminates the need for a...
KIC 2026 CIRCUITS ASSEMBLY Service Excellence Award for Soldering Equipment category based on customer feedback

KIC Earns 2026 Service Excellence Award Based on Customer Feedback

KIC, a leader in thermal process intelligence for electronics manufacturing, is proud to announce that it has received the 2026 CIRCUITS ASSEMBLY Service Excellence...
Groundbreaking ceremony for X-FAB's new cleanroom facility at the Erfurt site in Germany

X-FAB Breaks Ground on New Cleanroom in Erfurt

X-FAB was joined by representatives from government, industry, and academia to break ground on a new cleanroom at its Erfurt site. Through the Fab4Micro...
Magnalytix OE in a Box packaging for J-STD Objective Evidence reliability testing at SMTA International 2026

Magnalytix to Highlight Objective Evidence (OE) in a Box at SMTA International 2026

Magnalytix, providing real-time reliability solutions for electronics manufacturing, will exhibit at SMTA International, scheduled to take place October 25-29, 2026, at the Donald E....
Anda Technologies USA receiving the 2026 Circuits Assembly Service Excellence Award at PCB West, Santa Clara Convention Center

Anda Technologies USA Recognized with 2026 Service Excellence Award for Coatings/Encapsulants

Anda Technologies USA, Inc., a leading provider of fluid application and custom automated manufacturing equipment, has been recognized with a 2026 CIRCUITS ASSEMBLY Service...