‘Empower AI at the Edge’ - Advantech to showcase latest products in Edge AI at MECSPE 2025

‘Empower AI at the Edge’ – Advantech to showcase latest products in Edge AI...

Embedded IoT pioneer Advantech will be attending the MECSPE tradeshow to showcase the power of edge AI with a display of their latest products....

Ray Welch from Koh Young will Present a Paper on the Importance of Solder...

Koh Young Technology, the leader in True3D™ measurement-based inspection solutions changed the industry over 20-years ago with its multi-projection solder paste inspection machine. The...
Murray Percival Co.

The Murray Percival Company to Exhibit at SMTA International, Showcasing Premier SMT & PCB...

The Murray Percival Company, a trusted supplier to the Midwest's electronics industry, is pleased to announce its participation at SMTA International, October 21–23 at the...

Justin Worden Appointed President of Austin (Central Texas) SMTA Chapter

ROCKA Solutions is proud to announce that Justin Worden, Vice President of Sales & Marketing, has been appointed as President of the Austin (Central...
Koki Announces 2025 Webinar Series on Soldering Challenges and Innovations

Koki Announces 2025 Webinar Series on Soldering Challenges and Innovations

KOKI, a global leader in advanced soldering materials and process optimization services, is excited to announce its 2025 Webinar Series, featuring expert-led sessions on...

Inovaxe Presents Cutting-Edge LS Series Racks and MODI V5 at SMTA International

Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is pleased to announce plans to exhibit in Booth #1521at...

Koh Young USX Series of Inspection Machines for Ultra Large, Heavy Boards Wins Two...

Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced another pair of innovation awards. This time, Mexico EMS acknowledged the new...

Solderstar to Present Ground-Breaking Reflow Shuttle O2 at SMTconnect 2024

Solderstar, a global leader in temperature profiling equipment for soldering processes, is gearing up to showcase its latest innovation, the Reflow Shuttle with O2...
Indium Dongkai

Indium Corporation Expert to Present at Wafer-Level Packaging Symposium

Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr. Dongkai Shangguan, strategic advisor, at the Surface...

Celebrate Innovation by Supporting Olga “Dr.O” Ivanova for the TCT Women in 3D Printing...

Mechnano proudly announces the nomination of Olga "Dr. O" Ivanova, Director of Applications & Technology at Mechnano, for the prestigious TCT Women in 3D...