Koh Young Technology inspection systems and AI-powered solutions on display at NEPCON Asia 2026 in Shenzhen

Koh Young to Unveil Next-Generation Inspection and Smart AI Solutions at NEPCON Asia 2026

Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will unveil its latest inspection platforms and AI-powered process solutions at NEPCON...
Luxinar laser source used for PCB depaneling, cutting individual boards from a panel with precision

How Luxinar Lasers Optimize PCB Depaneling for Quality, Throughput and Process Stability

PCB manufacturers and equipment builders need to separate individual boards from a panel cleanly, repeatedly and at production speed without damaging the board, components...
KYZEN MICRONOX MX2123 cleaning chemistry winning the 2026 Mexico Technology Award at SMTA Guadalajara

KYZEN Wins Cleaning Materials Award from Mexico Technology Awards

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its MICRONOX® MX2123 cleaning chemistry has won a 2026...
PARMI Xceed II 3D AOI system displayed at SMTA Guadalajara 2026 Mexico Technology Award ceremony

PARMI Wins 2026 Mexico Technology Award for Advanced Laser-Based AOI Technology

PARMI, a leader in advanced 3D inspection systems, has announced that its Xceed II has received a 2026 Mexico Technology Award in the Inspection...
Machine Vision Products MVP semiconductor inspection AOI platform showcased at SEMICON West 2026

MVP Advances Semiconductor Inspection with Scalable AOI, Advanced Metrology, AI and Factory Integration at...

Machine Vision Products (MVP), a global provider of automated optical inspection technologies, will showcase its expanding semiconductor and microelectronics inspection portfolio at SEMICON West...
Fuji NXTR SMT pick and place machine performing placement of Broadcom Tomahawk 6 Davisson CPO Ethernet switch component

Fuji Achieves Industry-First Placement of Broadcom’s Tomahawk® 6 – Davisson

Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereafter referred to as "Fuji") conducted an SMT placement evaluation of Broadcom's...
Tresky digital beamsplitter system showing up-looking and down-looking camera alignment for DIE bonding process

Tresky Eliminates the Need for an Optical Beamsplitter During DIE Bonding

Tresky GmbH takes a consistently digital approach to the visual alignment of high-precision DIE bonding processes. The digital beamsplitter eliminates the need for a...
Green Circuits sixth SMT production line featuring Juki pick-and-place machines and Vitronics Soltec reflow oven

Green Circuits Increases SMT Capacity by 20% with Installation of Sixth Production Line

Green Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor...
KIC 2026 CIRCUITS ASSEMBLY Service Excellence Award for Soldering Equipment category based on customer feedback

KIC Earns 2026 Service Excellence Award Based on Customer Feedback

KIC, a leader in thermal process intelligence for electronics manufacturing, is proud to announce that it has received the 2026 CIRCUITS ASSEMBLY Service Excellence...
Groundbreaking ceremony for X-FAB's new cleanroom facility at the Erfurt site in Germany

X-FAB Breaks Ground on New Cleanroom in Erfurt

X-FAB was joined by representatives from government, industry, and academia to break ground on a new cleanroom at its Erfurt site. Through the Fab4Micro...