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KIC Relocates Global Headquarters to New San Diego Facility
KIC, the leader in smart thermal process technologies for electronics manufacturing, announced today that its global headquarters will relocate to a new, expanded facility...
Nihon Superior Co. Ltd. Mourns the Passing of Keith Howell
Nihon Superior Co. Ltd., an advanced joining material supplier, sadly announces the loss of Keith Howell, a highly respected industry professional and longtime company...
CompControl’s WEControlDOME Automates Inbound Logistics of Electronics with SVS-Vistek Vision Technology
In the precision-driven world of electronics manufacturing, incoming goods registration represents a critical supply chain bottleneck. CompControl IT-Service und Vertriebs GmbH, a holistic logistics...
Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability
Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated...
Malaysia Advances Semiconductor Manufacturing Footprint with CHIPX™
CHIPX™, a next-generation semiconductor and photonics manufacturer, announced plans to establish a state-of-the-art, 8-inch wafer fabrication facility in Malaysia, the first of its kind...
Global Electronics Association Unveils Powerhouse Tech and Innovation Keynote Speakers for APEX EXPO 2026
The Global Electronics Association announces its APEX EXPO keynote lineup, featuring industry titans who will explore the frontiers of quantum computing, artificial intelligence, and...
PCB West 2026 Booth Space Now Open to Any Exhibitor
The exhibition floor for PCB West 2026 is now open to any prospective exhibitor, the Printed Circuit Engineering Association (PCEA) announced today. The exhibit...
ASMPT Presents Optimized Odd Shaped Component (OSC) Package
With the optimized SIPLACE OSC Package, technology and market leader ASMPT SMT Solutions is strengthening the competitiveness of modern electronics manufacturing. The enhanced package...
ByteSnap Design Unveils New Insights on MISRA C Compliance in Real-world Applications
ByteSnap Design, one of the UK’s leading embedded software and electronic design companies, has released a practical guide to MISRA C compliance, drawing on...
Green Circuits Joins Edge Autonomy Partner Day for Inside Look at Next-Generation Uncrewed Systems
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, recently attended the Edge Autonomy Partner Day held in San Luis Obispo,...
