Yamaha reveals software innovations to boost printing, mounting, and intelligent factory

Yamaha Reveals Software Innovations to Boost Printing, Mounting, and Intelligent Factory

Yamaha Robotics Europe SMT Section has added new features to native equipment software and Intelligent Factory™ tools that accelerate equipment programming, increase production efficiency,...
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing

Dymax’s New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing

Dymax, a global manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of...
Bold Laser Automation Announces New LASR2424F Laser Automated Solder Reflow System

Bold Laser Automation Announces New LASR2424F Laser Automated Solder Reflow System

Bold Laser Automation, Inc. has announced the release of its new LASR2424F Laser Automated Solder Reflow System, engineered for high-precision, automated solder reflow of...
Kurtz Ersa Achieves IPC-CFX Certification for Hand Soldering with i-CON TRACE

Kurtz Ersa Achieves IPC-CFX Certification for Hand Soldering with i-CON TRACE

Kurtz Ersa Inc., a leading supplier of electronics production equipment, has reached a significant milestone in connected electronics manufacturing with the addition of its...
The Adaptsys Group to Demonstrate Inline Taping and Inspection Solutions at 2026 APEX EXPO

The Adaptsys Group Introduces 3DInspect for Automated Carrier Tape Inspection and CoC Reporting

The Adaptsys Group has introduced 3DInspect, an automated inspection system designed to simplify carrier tape verification and significantly reduce the time required to generate...
Nordson Electronics Solutions Announces Expanded Distributor Partnership with Assembly Products, Inc. a subsidiary of Blackstone Global, Across the United States and Canada

Nordson Electronics Solutions Announces Expanded Distributor Partnership with Assembly Products, Inc.

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, today announced an expanded distribution partnership with Assembly Products, Inc., a subsidiary of...
Fuji to Conduct R&D on High Accuracy Semiconductor Die Placement Processes Under SATAS Initiative

Fuji to Conduct R&D on High Accuracy Semiconductor Die Placement Processes Under SATAS Initiative

Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereinafter referred to as "Fuji") has joined the Semiconductor Assembly Test Automation...
VJ Electronix Partners with The Murray Percival Company to Expand Support Across the Midwest

VJ Electronix Partners with The Murray Percival Company to Expand Support Across the Midwest

VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, has appointed The Murray Percival...
Koh Young America Promotes Ramiro Mora to Lead Service and Applications in Mexico and South America

Koh Young America Promotes Ramiro Mora to Lead Service and Applications in Mexico and...

Koh Young Technology, the global leader in True3D™ measurement-based inspection solutions, is pleased to announce the promotion of Ramiro Mora to Service and Applications...
PARMI Appoints Rob Guthrie as Sales Manager for US’s Central Region

PARMI Appoints Rob Guthrie as Sales Manager for US’s Central Region

PARMI, a leader in advanced 3D inspection systems, has announced the appointment of Rob Guthrie as Sales Manager for the Central Region. Guthrie brings...