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      ECD Strengthens Engineering Team with New Software Development Hire

      July 30, 2026
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      July 30, 2026
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Home Authors Posts by Rebecca Lee

Rebecca Lee

Rebecca Lee
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ECD Strengthens Engineering Team with New Software Development Hire

ECD Strengthens Engineering Team with New Software Development Hire

Rebecca Lee - July 30, 2026
Siemens and Arizona State University Launch PCB Design Microcredential to Address Critical Hardware Design Skills Gap

Siemens and Arizona State University Launch PCB Design Microcredential to Address...

Rebecca Lee - July 30, 2026
ESSEGI Automation Showcases Open Integration at EFX 2026

ESSEGI Automation Showcases Open Integration at EFX 2026

Rebecca Lee - July 30, 2026
Koh Young Brings smart AI solutions to Consecutive SMTA Regional Events Across North America

Koh Young Brings smart AI solutions to Consecutive SMTA Regional Events...

Rebecca Lee - July 28, 2026
DISTRON Brings High-Reliability Medical Manufacturing Expertise to MEDevice Boston

DISTRON Brings High-Reliability Medical Manufacturing Expertise to MEDevice Boston

Rebecca Lee - July 27, 2026
Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design

Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design

Rebecca Lee - July 27, 2026
ESCATEC Expands Smart Manufacturing Capabilities with New Automated Line in Penang

ESCATEC Expands Smart Manufacturing Capabilities with New Automated Line in Penang

Rebecca Lee - July 27, 2026
PLUS Insights at EFX (6 – 8 October 2026, Stuttgart): The expert forum from trade journal PLUS will be taking place on the EFX Stage. | Copyright: Franziska Kraufmann / Messe Stuttgart

PLUS Insights at EFX: Lecture Programme Now Finalised

Rebecca Lee - July 27, 2026
IBL Löttechnik Presents Intelligent Process Control for Vapour Phase Soldering Technology at EFX 2026

IBL Löttechnik Presents Intelligent Process Control for Vapour Phase Soldering Technology...

Rebecca Lee - July 24, 2026
Advanced Packaging: Pricing Power Shifts as the Market Doubles

Advanced Packaging: Pricing Power Shifts as the Market Doubles

Rebecca Lee - July 24, 2026
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