Panel session at IMPACT 2026 conference on advanced electronic packaging and system integration in Taipei

Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with...

The Global Electronics Association today hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and...
Essemtec PUMA Ultra and FOX Ultra All-in-One SMT manufacturing platforms on display at NEPCON ASIA 2026

Essemtec to Showcase Advanced All-in-One Manufacturing Solutions for SMT and Advanced Packaging at NEPCON...

Essemtec, a global leader in adaptive SMT manufacturing solutions, will participate in NEPCON ASIA 2026, taking place from October 27-29, 2026, at the Shenzhen...
Seika Machinery year-end sale featuring cleaning, depaneling, and dry storage systems for electronics manufacturing

Seika Machinery Offers Year-End Savings on Proven Cleaning, Routing, and Dry Storage Technologies

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces its 2026 Year-End Sale, featuring special discounts or tariff surcharge...
Farnell exhibition stand at electronica 2026 in Munich, Germany, Hall B5 Avnet City stand 103

Visit Farnell at electronica 2026 and Explore Innovation

Farnell will exhibit at electronica 2026 in Munich, Germany, from 10 – 13 November. Visitors can find Farnell in Avnet City, Hall B5, stand...
Mikael Wahlsten, newly appointed Senior Vice President Pattern Generators at Mycronic AB

Management Change at Mycronic

Mycronic AB (publ) has appointed Mikael Wahlsten as Senior Vice President Pattern Generators and a member of Mycronic's Executive Management team, effective November 1,...
ASMPT SOLO placement head designed for large and heavy processor BGAs used in AI server applications

ASMPT presents new SOLO placement head for AI server applications

With its new SOLO placement head, ASMPT SMT Solutions, the global market and technology leader in integrated hardware and software solutions for the electronics...
SMTA Microelectronics Packaging & Integration Symposium 2027 banner, San Francisco, CA

SMTA Renames Event to Reflect Evolving Technology, Introducing the Microelectronics Packaging & Integration Symposium

SMTA is pleased to announce a new name and expanded technical scope for the former Wafer-Level Packaging Symposium. The new event is called the...
Essemtec advanced dispensing system for complex electronics assembly showcased at SMTA Space Coast Expo

Essemtec to Highlight Advanced Dispensing Solutions for Complex Electronics at SMTA Space Coast

Essemtec, a global leader in adaptive, highly flexible surface mount technology (SMT) solutions, is proud to announce that it will showcase its advanced dispensing...
Debbie McDade, Managing Director of Advanced Rework Technology Ltd, celebrating two honours at the 2026 Electronics Industry Awards

A.R.T. Celebrates Two Honours at Electronics Industry Awards

Advanced Rework Technology Ltd. (A.R.T.) is celebrating two honours at the 2026 Instrumentation and Electronics Industry Awards. Managing Director Debbie McDade won the Electronics...
PARMI 3D laser inspection system used for solder paste and AOI inspection in SMT electronics manufacturing

PARMI USA to Discuss Laser and AI Inspection Technology at SMTA Tampa Bay and...

PARMI, a leader in advanced 3D inspection systems, is proud to announce that it will highlight its advanced laser-based inspection technology and artificial intelligence...