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Green Circuits Appoints Kirk Knudsen as Vice President of Procurement to Strengthen Supply Chain Operations

Wendy Tindle - August 25, 2026

Indium Corporation to Showcase High-Reliability Power Device Packaging Solutions at PCIM Asia 2026

Green Circuits to Highlight High-Reliability Electronics Manufacturing for Small Satellite Applications at SmallSat 2026

Semi-Kinetics Achieves ISO 9001, AS9100 and ISO 13485 Certifications at New Idaho Facility

cts to Exhibit at EFX Alongside Partner AdoptSMT

Kubler US Appoints Cope Assembly Products as Sales Representative for Mid-Atlantic and Southeastern Regions

Rebecca Lee - January 16, 2025

Kubler US Corp, a leader in high-tech electronics solutions and strategic market development, is proud to announce the appointment of Cope Assembly Products (CAP)...

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KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology Portfolio

Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL fluid dispensing system for panel-level packaging at SEMICON Taiwan 2026

WEISUN – FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL fluid dispensing system for panel-level packaging at SEMICON Taiwan 2026

WEISUN – FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1

North American EMS Orders Surge in July as Book-to-Bill Stands at 1.29

SMTA Introduces New Academic Institution Membership

PCEA Names Brooke (Anglin) Downey VP of Sales

SMTA International Technical Conference Program Announced

PEMTRON to Highlight Connected Inspection Across the Line at SMTA Querétaro

KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology Portfolio

Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL fluid dispensing system for panel-level packaging at SEMICON Taiwan 2026

WEISUN – FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

Manufacturing

Green Circuits Appoints Kirk Knudsen as Vice President of Procurement to Strengthen Supply Chain Operations

Indium Corporation to Showcase High-Reliability Power Device Packaging Solutions at PCIM Asia 2026

Green Circuits to Highlight High-Reliability Electronics Manufacturing for Small Satellite Applications at SmallSat 2026

Semi-Kinetics Achieves ISO 9001, AS9100 and ISO 13485 Certifications at New Idaho Facility

cts to Exhibit at EFX Alongside Partner AdoptSMT

Kubler US Appoints Cope Assembly Products as Sales Representative for Mid-Atlantic and Southeastern Regions

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