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Wendy Tindle

Wendy Tindle
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BTU Introduces Advanced Formic Acid Reflow Capability for Fluxless Semiconductor Packaging

BTU Introduces Advanced Formic Acid Reflow Capability for Fluxless Semiconductor Packaging

Wendy Tindle -
CE3S Welcomes John Romanowicz as Strategic Sales Development Manager

CE3S Welcomes John Romanowicz as Strategic Sales Development Manager

Wendy Tindle -
Seika Machinery’s Sixth SMI 2026 Webinar Series Focuses on SAWA SMT One-Stop Solution for Stencil Management

Seika Machinery’s Sixth SMI 2026 Webinar Series Focuses on SAWA SMT...

Wendy Tindle -
Microscreen Opens New Stencil Manufacturing Facility in Oxford, Connecticut

Microscreen Opens New Stencil Manufacturing Facility in Oxford, Connecticut

Wendy Tindle -
Alternative Component Network Expands with Seven New Manufacturing Partners

Alternative Component Network Expands with Seven New Manufacturing Partners

Wendy Tindle -
Selective PCB potting using the dam-and-fill process protects defined areas of highly integrated automotive PCBs

PCB Potting for Battery Management Systems: How Polyurethanes Ensure Reliable Automotive...

Wendy Tindle -
KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

KYZEN to Focus on AI Chip Reliability and Advanced Packaging at...

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Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Wendy Tindle -
Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology Portfolio

Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology...

Wendy Tindle -
Nordson Electronics Solutions introduces the new ASYMTEK Vantage® XL precision fluid dispensing system for panel-level packaging (PLP) during semiconductor manufacturing at SEMICON Taiwan 2026.

Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL fluid dispensing...

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