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Home Authors Posts by Rebecca Lee

Rebecca Lee

Rebecca Lee
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Seika Machinery Launches Post-APEX Spring Sale on In-Stock and Demo Equipment

Seika Machinery Launches Post-APEX Spring Sale on In-Stock and Demo Equipment

Rebecca Lee - March 30, 2026
Indium Corporation Indium12.9HF Receives New Product Introduction Award

Indium Corporation Indium12.9HF Receives New Product Introduction Award

Rebecca Lee - March 30, 2026
Datest Invites Engineers to Stop Fighting AXI False Calls (and Start Winning)

Datest Invites Engineers to Stop Fighting AXI False Calls (and Start...

Rebecca Lee - March 30, 2026
Thermal-Efficient Efinix Titanium Ti135 Eval Board for Next-level Edge Computing

Thermal-Efficient Efinix Titanium Ti135 Eval Board for Next-level Edge Computing

Rebecca Lee - March 30, 2026
KOKI Europe Highlights S3X58-HF1200 Lead-Free Solder Paste for Low Voiding, Stable Reflow Performance, and Extended Shelf Life

KOKI Europe Highlights S3X58-HF1200 Lead-Free Solder Paste for Low Voiding, Stable...

Rebecca Lee - March 30, 2026
KIC to Exhibit Smart Thermal Process Solutions at SMTA Dallas Expo & Forum

KIC to Exhibit Smart Thermal Process Solutions at SMTA Dallas Expo...

Rebecca Lee - March 30, 2026
Seika Machinery Recognizes Top Sales Representatives at APEX 2026 Training Meeting

Seika Machinery Recognizes Top Sales Representatives at APEX 2026 Training Meeting

Rebecca Lee - March 30, 2026
TTCI’s Sam Fortna Actively Participates in IPC 2-40 Committee to Advance PCB and PCBA Standards

TTCI’s Sam Fortna Actively Participates in IPC 2-40 Committee to Advance...

Rebecca Lee - March 30, 2026
Unitemp Announces UK Availability of ESPEC’s New Deep Capacity HAST Chamber for Large PCB Reliability Testing

Unitemp Announces UK Availability of ESPEC’s New Deep Capacity HAST Chamber...

Rebecca Lee - March 27, 2026
Intelligent Process Control with Lab-on-a-Chip and AI-based Smart Drying

Intelligent Process Control with Lab-on-a-Chip and AI-based Smart Drying

Rebecca Lee - March 27, 2026
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