NetVia Group, a leading U.S.-based manufacturer of high-reliability printed circuit boards (PCBs), announced an investment of more than $1 million in advanced manufacturing equipment, cybersecurity infrastructure, and CMMC certification and compliance initiatives. These investments are designed to expand technical capabilities, increase production capacity, strengthen cybersecurity and regulatory compliance, and support growing demand for complex, high-reliability PCB technologies, particularly within the aerospace and defense markets.
The investment includes four major equipment additions and upgrades, along with significant resources dedicated to CMMC readiness and compliance, reinforcing NetVia’s commitment to advanced, secure domestic PCB manufacturing.
The new MicroCraft EMMA flying-probe tester expands NetVia’s electrical testing capabilities for complex, high-density PCBs.
Key benefits include:
- Improved detection of opens, shorts, and electrical defects.
- Faster testing of prototypes and high-mix production without dedicated fixtures.
- Enhanced testing precision for fine-pitch and high-density designs.
- Increased testing capacity and faster turnaround times.
- Embedded resistor testing and reporting.
- High-voltage HiPot Testing.
The upgraded Multiline system improves inner-layer registration accuracy and manufacturing consistency.
Key benefits include:
- Full rebuild – better cameras, new punch blocks, updated PC and software.
- Greater layer-to-layer alignment precision.
- Improved yields and reduced registration defects.
- Enhanced capabilities for complex, high-layer-count PCBs.
- Better process repeatability and manufacturing efficiency.
The new Pluritec Inspecta system uses X-ray imaging to accurately locate internal PCB targets, accurately measure and calculate layer scaling, and position registration and tooling holes.
Key benefits include:
- Ability to see inside the panel and accurately measure per-layer scale with an automated process.
- Improved multilayer registration accuracy.
- Compensation for material movement during manufacturing
- Reduced registration-related defects.
- Greater precision for complex multilayer constructions.
The addition of a second Boffotto plasma etch system significantly expands NetVia’s plasma processing capacity.
Key benefits include:
- Increased capacity and reduced manufacturing bottlenecks.
- Improved processing of advanced dielectric materials.
- Enhanced drilled-hole preparation for reliable metallization.
- Additional equipment redundancy and production flexibility.
These investments strengthen NetVia’s ability to manufacture increasingly complex PCBs while improving quality, manufacturing efficiency, delivery performance, and the security of sensitive customer information.
“Our customers continue to demand more complex PCB technologies, tighter tolerances, and faster turnaround times,” said Epec’s CEO Ed McMahon. “This investment of more than $1 million reflects our commitment to staying ahead of those requirements by continually improving our equipment, processes, and manufacturing capabilities.”
As PCB technology advances toward higher layer counts, finer circuitry, and more exotic materials, NetVia remains focused on investing in the equipment and expertise necessary to support these requirements.
“Our objective is simple: provide our customers with the advanced domestic manufacturing capabilities they need today while preparing for the technologies they will require tomorrow,” McMahon added.
About NetVia Group
NetVia Group is a U.S.-based manufacturer specializing in high-reliability printed circuit boards for aerospace, defense, medical, industrial, and advanced electronics applications. As part of Epec Engineered Technologies, NetVia benefits from the resources and expanded manufacturing capabilities of a global electronics manufacturing organization committed to quality, innovation, and customer service.
