Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in Nashville, Tennessee. Scheduled for 1:30-4:30 p.m., the workshop is titled Vehicle Electrification and U.S. Manufacturing: Building the EV While We Drive It. O’Leary will be joined on the panel by Debbie Carboni (KYZEN Corporation), Brian Chislea (Dow Chemical Company), and Dwight Howard (formerly with APTIV LPC).

Climate change, government policy, and consumers are rapidly driving the automotive industry towards an electrified future. The printed circuit board assembly (PCBA) manufacturing industry has a vital role to play in this transition. From longer mission profiles to higher voltages, PCBAs are required to work longer, harder, and at higher operating temperatures. The first half of the workshop will provide presentations addressing the current state of the industry, supply chain and standards challenges, as well as opportunities for the manufacturing sector. The second half will be an interactive and informative panel discussion.

O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, and battery energy storage systems. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on electronics manufacturing and currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, O’Leary co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

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