Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has been awarded a New Product Introduction (NPI) Award 2023 by Circuits Assembly Magazine in the category of “Inspection Equipment – AOI Systems”. At the award ceremony on January 23rd at the IPC APEX Expo 2023 in San Diego, Saki’s innovative in-line 3Di AOI machine series was recognized by an independent judging panel of practicing engineers for its industry-leading high-speed, high-performance inspection capability for incredibly complex, high-density packaging technologies.

The 3Di series is Saki’s latest high-speed, high-precision, in-line 3D AOI solution for complex inspection of high-density printed circuit boards, and boards with a combination of ultra-small and tall components. It features a unique and easy onsite interchangeable camera system with 8μm and 15μm resolution options and an extended height measurement range up to 40 mm. The closed-loop, dual servo-motor drive system, high-resolution linear scale, and durable high-rigidity machine frame enable high-speed movement of the optical head with impressive stop-position accuracy.

In combination with the cutting-edge bespoke software, these hardware innovations achieve the industry’s fastest cycle time for AOI systems, produce ultra-sharp, high-resolution 3D images and offer maximum flexibility with quick and easy on-site changeover capability between the 8μm and 15μm camera systems.

The 3Di series simultaneously and accurately inspects high-density PCBs with ultra-small components (such as 0402mm or 0201mm), narrowed pitch ICs, THT, closely located pads, and tall parts.

Further key features include:

  • Sophisticated software and hardware configuration that optimizes image processing to achieve the industry’s fastest cycle time;
  • Crisp and clear 3D multi-layer solder joint imagery achieved with a unique custom inspection algorithm;
  • Easy-to-modify configurations that provide impressive scalability through interchangeable camera heads, adaptable AI functions, and more – all effortlessly and rapidly undertaken on-site.

We are thrilled to receive this prestigious annual award from Circuits Assembly in recognition of our innovative work in automated optical and X-ray inspection technology,” said Craig Brown, newly appointed General Manager of Saki America. “Our R&D team works tirelessly to develop unique solutions that meet the need for fast precision inspections of rapidly evolving component technologies. We believe this award is not only a testament to their dedication but also serves as a reminder of Saki’s commitment to providing reliable and innovative solutions for our customers around the world.”

Read more about Saki’s latest 3Di Series automated optical inspection system here. For more information about Saki visit