Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9—5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Heating PCBs for soldering can potentially lead to substrate and component warpage, causing parts to expand and contract, and leading to common soldering defects such as HIP/HOP and non-wet opens. High-temperature, lead-free soldering has exacerbated
these problems. To help solve these issues, interest in low-temperature solders for reflow and selective soldering has grown. However, not all companies have the ability to change the alloys they use. Willis will provide practical insights for common—and not so common—soldering and assembly problems relating to warpage. Some of the solutions, as well as “shop floor tricks,” will also be illustrated.
Subjects covered in this webinar will include:
- PCB substrate warpage
- Component package warp
- Connector lifting
- QFP pin opens
- Process simulation and inspection methods
- BGA solder shorts and opens
- Missing pins
Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at www.indium.com/webinar
