January 08, 2018 – Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will showcase its extensive range of tec-speed© materials for high-speed low-loss applications including the latest tec-speed© 10 ultra-low dk material at DesignCon 2018 show in Santa Clara, CA, USA from 30th January to 1st February on booth #118. A further highlight will be a next generation best-in-class, thermally conductive (8 X FR4) high Tg thin-core and prepreg material (VT-5A2) ideal for hybrid multilayer low-loss constructions. Ventec will be exhibiting at DesignCon 2018, the premier conference for chip, board, and systems design engineers, on booth #118 highlighting it’s tec-speed© range of PCB materials for high-speed low-loss applications. By using an ultra-low Dk material with Dk values between 2.3 and 2.8 lower losses, lower system power requirements and with it the delicate balance of performance and cost can be achieved. Higher layer counts on backplanes, daughter cards and hand-held’s are made possible in a smaller footprint by having smaller layer to layer separation without sacrificing trace width.
“Maintaining wider traces produces lower resistance in the signal path” said Martin Cotton, Director – OEM Technology Marketing. “Combining ultra-low Dk with a low Df of 0.003 to 0.004, produces an alternative to ever smaller traces and higher power requirements.”
Ventec’s highest performance thermally conductive laminate material so far will also make its DesignCon-debut. VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide based materials including tec-speed®, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions. Ventec’s Martin Cotton (Director – OEM Technology Marketing) and Peter Koolen (Global Account Manager OEM Technology Marketing) will be on hand to offer technical advice.
For more information you can also visit Ventec International