Quantification of ionic contamination present on electronic assemblies is of extreme importance, especially when the end product functions within harsh environments. Marietta Lemieux of STI will present research on detection levels of ionic contamination trapped under leadless and BTC components. The data finds that the extraction time is an important consideration when qualifying and validating levels of contamination on production assemblies.
Electrochemical failure modes increase when ionic contamination is mobilized on a board assembly under environmental stress. Dr. Mike Bixenman of KYZEN Corporation will present advanced methods for characterizing ionic contamination under leadless component bodies. The data finds that these test methods can be implemented at the assembly site to characterize the reliability of incoming bare boards, soldering materials, leadless and bottom terminated components.
The use of X-ray technology to inspect for the presence of voids enables a non-destructive analysis. David Bernard will present on the Advances in 2D and 3D (CT) X-Ray inspection. Recent developments enable limited angle computer tomography (CT) as well as the use of full CT algorithms to improve analysis clarity to locate the source of voiding problems.
For more information about the event, visit smt.digital/harsh