YAVNE, Israel, December 2017 – Orbotech Ltd., (NASDAQ: ORBK) a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, today announced a multi-million dollar order from Taipei-based Career Technology (Mfg.) Co., Ltd. a worldwide manufacturer of flexible printed circuit (FPC) PCBs for advanced electronic devices, for Orbotech’s industry-leading Nuvogo™ for Patterning DI and Orbotech Diamond™ 8 for Solder Mask DI solutions. The solutions, which will be deployed in Career’s fabs in Taipei, Taiwan and Kunshan, China, will be used for flexible PCB manufacturing for next-generation smartphones. Flexible PCBs are commonly used in smartphones to enable highly versatile interconnects which facilitate smaller, lighter and more functional devices.
Orbotech was our obvious choice for this most recent expansion of our DI capabilities as it continues to lead by its development of innovative PCB manufacturing processes. We look forward to further collaboration in the future as Career continues to grow its advanced high quality, high yield, flexible PCB production capabilities.
“We are honored to be repeatedly selected by Career – with whom we have enjoyed a long-term business relationship – as a partner of choice,” said Mr. Hadar Himmelman, President of Orbotech Pacific. “Orbotech’s solutions are critical tools in advanced PCB manufacturing processes as the requirements for advanced smartphone production become increasingly demanding, functionality grows and form factors shrink.”
Nuvogo™ is Orbotech’s industry-leading Direct Imaging (DI) series of solutions. Utilizing a high-power laser and unique MultiWave Laser Technology™, the Nuvogo provides maximum flexibility on a wide range of materials and applications, including flex, rigid-flex, HDI and advanced HDI. Incorporating Orbotech’s field-proven Large Scan Optics (LSO) Technology™ with its high depth-of-focus, the Nuvogo is a perfect match for flex patterning and solder mask applications that demand fine structures on variating topography. This powerful solution is designed for high throughput while enabling superior quality.
About Orbotech Diamond™ 8
Orbotech Diamond™ 8 is Orbotech’s highly accurate high-throughput mass production DI solution for Solder Mask. Powered by Orbotech SolderFast Technology™, Orbotech Diamond 8 is particularly suited for very complex designs, improving throughput, yield and productivity. Orbotech SolderFast™ technology employs a wide UV spectrum to ensure high throughput and superior quality on a variety of solder resists. Patented optics and high energy illumination enable wide DoF (depth of focus), ensuring consistent, precise imaging quality to overcome the most challenging surface topography variations as well as any distortions or abnormalities.
About Career Technology Ltd.
Career Technology (Mfg.) Co., Ltd. is a Taiwan firm principally engaged in the design, research, development, manufacture and distribution of flexible printed circuits (FPCs) boards. The company has market cap of $9.32 billion. The Company’s primary products include single-sided FPCs, double-sided FPCs and multilayer FPCs boards. It has a 137.27 P/E ratio. The Company’s products are mainly used in the manufacture of smart phones, notebook computers, mobile phones, flat panel displays and computer peripheral products, among others. www.careergroups.com
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality (‘reading’); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces (‘writing’); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing (‘connecting’). Orbotech refers to this ‘reading’, ‘writing’ and ‘connecting’ as enabling the ‘Language of Electronics’. For more information, please visit www.orbotech.com and www.spts.com