Liberty Lake, WA, USA – 9 January 2019 – Nordson SELECT, a Nordson company (NASDAQ: NDSN), a global provider of selective soldering systems, is pleased to announce its Integra® 508.3 will make its North American debut at the 2019 IPC APEX Expo, scheduled to take place January 29-30, 2019 at the San Diego Convention Center in San Diego, California.
The Integra® 508.3 is a multi-station selective soldering system designed for high-volume applications with maximum throughput. With its flexible configuration, the Integra® 508.3 is a versatile selective soldering platform and can be equipped for either single, parallel or double processing. When configured with dual drop-jet fluxers and dual solder pots, the Integra® 508.3 can solder two boards at the same time in each soldering station. When operated in the parallel mode, the Integra® 508.3 can process up to six boards at one time significantly increasing machine productivity.
Also featured will be a range of selective soldering systems for various applications, including the award-winning Integra® 103ILD, the versatile Cerno® 103IL, and the compact Novo® 300.
The Integra® 103ILD is a dual pot selective soldering system and features Nordson SELECT’s unique automatic solder nozzle tinning system. Unlike other nozzle cleaning systems, Nordson SELECT’s patent pending system does not spray an adipic acid, or a liquid or powdered flux. This exceptional solder nozzle tinning system keeps the solder nozzles prestigiously clean by automatically removing oxidation residues and re-tinning the surface of the solder nozzles without any resulting overspray or contamination of the printed circuit board or the selective soldering machine.
Nordson SELECT’s Cerno® 103IL is a fully-configured SMEMA compatible selective soldering system equipped with standard features including interchangeable solder pots and pumps compatible with tin-lead, lead-free and HMP solder alloys. The Cerno® 103IL comes standard with an automated fiducial location and correction system that provides single click fiducial teach capability, seamless fiducial recognition and true automated alignment and skew correction of a printed circuit board. The system also features board mapping and pattern recognition of a correct board assembly, x-out circuits or missing components.
Also on display will be the Novo® 300, an entry lvel selective soldering platform with a compact footprint requiring less than 1.1 square meters of factory floor space. The Novo® 300 is a standalone platform that is ideally suited for prototype, cell manufacturing or small batch production.