Aylesbury, Buckinghamshire, UK — October 2017 — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces plans to exhibit at the 14th annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place Oct. 24-26, 2017 in San Jose, CA. The Nordson DAGE inspection experts will discuss the XM8000 Wafer X-ray Metrology Platform in Booth #1.
The semiconductor market demands increasingly complex devices that are enabled by technologies such as TSV, PoP, 2.5D and 3D integration. These complex products demand a new level of metrology. Nordson DAGE, the leader in X-ray inspection for the electronics industry, presents the XM8000 X-ray metrology platform, for the fast, fully-automated, non-destructive measurement of, and within, metal features on up to 300 mm wafers.
The XM8000 system delivers fully automated, non-destructive, radiation safe defect detection for all complex devices, and is 30X faster than traditional X-ray. This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.
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