Aylesbury, Buckinghamshire, UK — November 2017 — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it was awarded a 2017 Global Technology Award in the category of Metrology for its XM8000 Wafer X-ray Metrology Platform. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place at productronica in Munich, Germany. This marks Nordson DAGE’s 20th award for its digital X-ray inspection systems and bond test equipment. The semiconductor market demands increasingly complex devices that are enabled by technologies such as TSV, PoP, 2.5D and 3D integration. These complex products demand a new level of metrology. Nordson DAGE, the leader in X-ray inspection for the electronics industry, presents the XM8000 X-ray metrology platform, for the fast, fully-automated, non-destructive measurement of wafers.
The XM8000 system delivers fully automated, non-destructive, defect detection for all complex devices, and is 30 times faster than traditional X-ray. This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.
The XM8000 Platform illustrates Nordson DAGE’s dedication and investment into our Research and Development facility allowing Nordson DAGE to be at the forefront of technology, developing innovative award-winning products that meet and exceed our customers’ exacting demands.
Our commitment and foresight will ensure Nordson DAGE remain as market leader, producing ‘Best in Class’ products.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
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