Machine Vision Products to show their powerful, flexible AOI Solutions for Semiconductor, Microelectronics and Packaging at Productronica 2019

Vista, CA, USA – November: Machine Vision Products today announced it would be demonstrating its true flexibility and powerful inspection capabilities with a wide variety of applications at the Productronica 2019 exhibition. The exhibition is at Messe München in Munich from November 12th to 15th 2019. This year Machine Vision Products are exhibiting in Hall B2 Stand 124.

Total Solutions Provider

MVP are advanced AOI experts and a total solutions provider now in our 25th years of implementation of end-to-end innovative inspection solutions within Semiconductor, Microelectronics, Packaging and Surface Mount, for industries such as automotive, telecoms, commercial, medical devices and military.

MVP is known for being a leading innovator of AOI solutions with a global support structure that is internationally recognized.

MVP works with the world’s leading electronics manufacturers building quality into their processes. We provide not just inspection but powerful, flexible and accurate metrology inspection. Complex inspection challenges are second nature to MVP.

Machine Vision Products to show their powerful, flexible AOI Solutions for Semiconductor, Microelectronics and Packaging at Productronica 2019

With unmatched flexibility MVP develops custom material handling solutions allowing for double sided inspection, ultra-high-speed inspection and handling of multiple types of material presentation types from dice wafers to Jedec trays, lead frames to waffle packs and from substrates and carriers to traditional SMT handling.

Powerful inspection capabilities range from wafer and dice wafer to complex die and wire bond inspection to hybrid and SMT.

MVPs metrology based AOI systems include the inline 850G, the 850 and 2020 DWMS for lead frame and substrate inspection, as well as the 850 DW for Dice Wafer. All systems are capable for Class 100 cleanroom configurations.

MVP also provides defect sorting, defect marking and SECS/GEM E142 eMapping capabilities. Physical marking options include punch, wire cutter, inker and our new Laser Marking capability.

3D AOI and Microscopic Capabilities

This year sees MVP introducing new inspection capabilities including 3D with Confocal. 3D laser with scalable resolution will allow MVP to provide capabilities including wafer bump, die tilt, clip inspection, solder paste and 3D AOI for SMT post reflow inspection.

Advanced Data Analysis

With capability to utilize the metrology data it gathers, whether attribute or measurement data, MVP is also a supplier of advanced data analysis solutions, image archiving solutions and process control tool solutions encompassing big data in accordance with the principles of Industry 4.0.