SINGAPORE – Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today the official opening of their China Demo Center in its Suzhou manufacturing facility. K&S Suzhou was established in 2002, spanning over 17,000 square meters, encompasses the company’s equipment software and process engineering, R&D as well as production lines for consumables products such as capillaries, blades and wedge bonding tools.
The 1,200 square meters Demo Center houses a broad assembly line of the latest K&S solutions, including RAPID™ Pro GEN-S (Smart) Series ball bonder, OptoLux™ ball bonder for LED and APAMA™ DA (Die Attach) equipment. Customers can now visit the site for demonstration of the end-to-end Surface Mount Technology (SMT) solution and to develop rapid prototyping setup from screen printing, soldering paste inspection, pick-and-place to Automated Optical Inspection (AOI) systems. Besides the SMT solution, a full assembly line of K&S CMOS Image Sensor (CIS) solution is anticipated to complete in the next few weeks. The new China Demo Center also includes equipment repair and refurbishment facilities.
“The opening of Kulicke and Soffa’s China Demo Center marks another significant milestone for the Company. It further strengthen our strong collaboration with customers and industry partners to develop and drive next-generation packaging solutions in response to the industry’s emerging opportunities,” said Fusen Chen, Kulicke and Soffa’s President and Chief Executive Officer.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)