IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020 in San Diego

BANNOCKBURN, Ill., USA, September 10, 2019 IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.

IPC APEX EXPO

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially:

• 3D Printing in Electronics Manufacturing

• Automation in Electronics Manufacturing

• Adhesives

• Advanced Technology

• Area Array/Flip Chip/0201 Metric

• Assembly and Rework Processes

• BGA/CSP Packaging

• Black Pad and Other Board Related Defect

Issues

• BTC/QFN/LGA/MLF Components

• Business & Supply Chain Issues

• Cleaning

• Conformal Coatings

• Corrosion

• Counterfeit Electronics

• Design

• Electromigration

• Electronics Manufacturing Services

• Embedded Passive & Active Devices

• Environmental Compliance

• Graphene in Electronics Manufacturing

• Lean Six Sigma

• LED Manufacturing

• Failure Analysis

• Flexible Circuitry

• HDI Technologies

• Head-on-Pillow

• Board and Component Warpage

• High Speed, High Frequency & Signal

Integrity

• Industry 4.0

• Lead-Free Fabrication, Assembly &

Reliability

• Miniaturization

• Nanotechnology

• Optoelectronics

• Packaging & Components

• PCB Fabrication

• PCB and Component Storage & Handling

Performance

• Quality & Reliability

• Photovoltaics

• PoP (Package-on-Package)

• Printed Electronics

• Reshoring

• RFID Circuitry

• Robotics

• Soldering

• Surface Finishes

• Test, Inspection & AOI

• Tin Whiskers

• 2.5-D/3-D Component Packaging

• Underfills

• Via Plugging & Other Protection

• Wearables

An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by Friday, November 15, 2019, to https://ipcapexexpo2020.ipc.org/secure/CFPosters.aspx.

For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org. or Brook Sandy-Smith, IPC technical education program manager, at BrookSandy@ipc.org