Indium Corporation to Feature New Solder Paste

Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.

Indium11.8HF-SPR specifically addresses customers’ needs for Type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.

Indium11.8HF-SPR benefits:

  • Halogen-free per IEC 61249-2-21 test method EN14582
  • High-transfer efficiency through small apertures
    (≤ 0.66AR)
  • Long stencil life (>12 hours)
  • Eliminates hot and cold slump to inhibit bridging and solder beading defects
  • Avoids the potential for HIP and graping defects with a unique oxidation barrier

To learn more about Indium11.8HF-SPR, visit Indium Corporation at the show at booth #1625.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.