Indium Corporation’s Dr. HongWen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the International Electronics Manufacturing Initiative (iNEMI) Packaging Technology Integration Group (TIG) digital meeting on Wednesday, May 27 at 22:00 p.m. JST.
The practice of soldering has been around for thousands of years, but recent advances in soldering materials provide industrial users with more options than ever: low-temperature, middle-temperature, high-reliability solder for automotive applications, and Pb-free high-temperature solder. In Challenges in Solder Materials, Dr. Zhang will discuss why a customer might choose a specific solder product, what potential processing defects exist, and anticipated drop shock performance, reliability, and challenges.
The meeting is open to iNEMI Packaging TIG members. If you wish to participate, please contact iNEMI directly.
Dr. Zhang is Manager of the Alloy Group in Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-temperature and high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control the joint’s morphology, thus improving the reliability. On the basis of this technique, the BiAgX® solder system was invented as an alternative high-temperature lead-free solder.
Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials science and engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in mechanical engineering, and a Ph.D. in materials science and engineering from Michigan Technological University. He has extensive experience in various aluminum (Al) alloys and fiber/particle-reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. Dr. Zhang co-authored two book chapters on high-temperature lead-free bonding materials. He and his colleagues have had seven patents granted globally and have filed numerous other patents. He has published approximately 20 journal publications in the field of metallurgy, materials science and engineering, physics, electronics materials, and mechanics. He has also been invited as a peer reviewer for numerous journals. Dr. Zhang has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC Specialist for IPC-A-600 and IPC-A-610D.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.