Dorigo Systems Utilizes Industry’s Fastest Full 3D Solder Paste Inspection System

Dorigo Optimizes PCB Assembly Using True 3D Optical Inspection for High Speed Production

Burnaby, BC, Canada – December 2018 – Dorigo Systems has integrated the Koh Young KY8030-3 Solder Paste Inspection (SPI) and 3D AOI system into its high speed Printed Circuit Board (PCB) assembly lines providing true 3D optical inspection. Dorigo is one of only a few select EMS providers in Canada that uses a true 3D measuring system providing foreign material inspection for the entire PCBA – vastly improving the ability to detect board defects during the manufacturing process.

“At Dorigo Systems, we continue to adapt our electronics manufacturing processes to achieve close to zero board defects,” states Paul Vasvary, Business Development Manager, Dorigo Systems. “By implementing the Koh Young Technology that analyzes true 3D measurement, Dorigo is building PCBA’s right the first time.”

By accessing all board data, Dorigo Systems uses an inspection solution that collects and analyzes large amounts of data producing traceable results and increasing board quality. The Koh Young KY8030-3 SPI and 3D AOI system detects all kinds of board defects using patented shadow-free 3D moiré technology including: missing, offset, rotation, polarity, upside down, OCV/OCR, solder filet, billboarding, lifted lead, lifted body, and tombstone bridging.

Dorigo Systems Utilizes Industry’s Fastest Full 3D Solder Paste Inspection System

 “The Zenith series provides superior results by measuring every aspect of the component and solder joint according to IPC-A-610 standards,” says Chas Yu, Dorigo’s Quality Manager. “By quickly measuring components and solder joints, and then offering critical height information to the inspection algorithms, we can now immediately identify errors like pad overhang and insufficient solder.”

The Koh Young KY8030-3 SPI and 3D AOI system uses data-driven analytics to overcome production challenges and enables smart manufacturing for Dorigo Systems high speed lines vastly improving board inspection. True 3D optical scanning removes shadow problems by utilizing 8-way projection while providing accurate PCB inspection data with real-time PCB warp compensation.

“When it comes to building high-precision electronics, there is no margin for error,” states Paul Vasvary, Business Development Manager. “3D optical inspection ensures we continue to provide superior electronics manufacturing services to our customers.”