New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

DELAWARE, OH ― March 2018 ― Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications. EMS DA-6010 has a moderate glass transition temperature (Tg) and modulus. With an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, DA-6010 is designed to adhere to both flexible and rigid substrates.

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications
Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications

DA-6010 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications. For more information about the DA-6010 Non-Conductive Die Attach Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.