Hanover, May 2019 – Viscom announces that it was awarded recently the Mexico Technology Award in the inspection equipment cluster for its new automatic 3D X-ray inspection system X7056-II. Thus, Viscom has proven its innovativeness on the most important international markets of the USA, Mexico, Europe and Asia.
The highly innovative 3D X-ray inspection system X7056-II has been awarded five times since bringing it onto the market: with the productronica innovation award 2017 (Inspection & Quality cluster), the CIRCUITS ASSEMBLY 2018 New Product Introduction Award (Test & Inspection cluster), the 2018 SMT China VISION Award (Inspecting & Testing cluster), the EM Innovation Award 2018 from Electronics Manufacturing Asia and the Mexico Technology Award, likewise presented in 2018.
With its extremely high throughput and superb image quality, the awarded X7056-II inline system is ideal for the requirements in high-end electronics production. Its cutting-edge 3D X-ray technology ensures precise inspection of hidden solder joints and components in high-volume production, including head-in-pillow defects at fine-pitch ball grid array packages.
The X7056-II is equipped with the unique xFastFlow transport module, which cuts printed circuit board changing times down to four seconds. With this feature, up to three boards can be processed at the same time. Furthermore, the system can be extended with additional automatic optical inspection (3D AOI) within its existing housing.