Somerset, NJ – December 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the upcoming Intersolar India taking place December 11-13 in Bangalore, India.
Narahari Pujari, R&D Manager for Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, will present a technical paper on A review of Interconnection Technology for Floating PV Applications that critically assesses various cell designs, material and techniques to join cells for floating PV assemblies.
“It is reported that 40.7% of cSi PV (photovoltaic) modules fail at interconnection in a module’s lifespan. This risk is even higher in floating PV applications. This is due to high moisture content and corrosion resulting from adverse environmental conditions as well as instability in times of inclement weather, hazardous condensation in the interior etc.,” said Pujari. “Additionally, joints that are exposed to fatigue loading and vibrations have shown metal segregation, grain boundary coarsening/cracking, increased series resistance and heating issues. The industry is still evaluating interconnection options in new cell designs. All these make the review of interconnection technologies employed in floating PV imperative.”
Pujari’s paper will demonstrate the role of non-corrosive flux and EVA compatibility studies. In addition, use of lead-free soldering and solder paste technologies to support the current design trend of new cell architectures will be presented. Both options are cost efficient and could improve the module performance and consequently extend the mean-time-to-failure (MTTF).