AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu & Derek Wang received the awards for Best Presentation in their respective technical sessions at the SMTA China East Technical Conference in Shanghai, China. Dillon Zhu’s presentation, titled “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction,” generated great interest among attendees. This study highlighted stencil and reflow modifications that can be deployed to consistently and repeatedly reduce void formation on BTC style devices. Derek Wang’s presentation highlighted AIM’s new REL alloys which were developed to provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22TM is an award-winning, high reliability alloy with durability characteristics that double the reliability of SAC305 in harsh environments. REL61TM is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys. With a 10°C lower melting temperature and superior wetting performance versus SAC305, REL61 can lower process temperatures, prevent PCB damage, and reduce costs and waste.
About Dillon Zhu
Dillon Zhu is Regional Technical Support Manager for AIM and, with over 15 years of experience, is an expert in SMT manufacturing. Since joining AIM in 2008, he has assisted many clients in diagnosing and correcting SMT and wave solder production challenges.
About Derek Wang
Derek Wang is a Technical Support Manager for AIM Solder. He is a SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over thirteen years’ experience in the SMT industry, Derek supports AIM customers in Eastern China.
August 9, 2018 – SMTA Tijuana – Tijuana BC Mexico
August 16, 2018 – SMTA Queretaro Roundtable – Hotel Misión Juriquilla, Querétaro, Mexico
August 23, 2018 – SMTA Capital – Kossiakoff Center, Laurel, MD